Currently "Micro Cooling Fan" PCB material is widely used copper / epoxy glass cloth material or phenolic resin glass cloth material, as well as a small amount of paper-based CCL material used. These substrates certainly have excellent electrical properties and processing performance, but poor heat dissipation, cooling channels as high heating element, almost can not expect to conduct heat from the PCB itself resin, but the heat from the surface of the element to the surrounding air. But with "Micro Cooling Fan" has entered into member miniaturization and high density mounting, high fever of assembly times, if only by a very small surface area to dissipate heat of the surface element is not enough. The same time as QFP, BGA, etc. widely used surface mount components, a large amount of heat generated by components pass PCB board, therefore, the best way to solve the heat of the heat generating element is in direct contact with the progress of heat dissipation PCB itself, by "Micro Cooling Fan"PCB board transfer out or dissipate.